Lisebelisoa tsa ceramic li ntse li eketseha ho fetoha karolo ea mantlha ea tlhahiso e phahameng ea lefatše. Ka lebaka la ho thatafala ha tsona, ho hanyetsa mocheso o phahameng, le ho hanyetsa ho bola, lirafshoa tse tsoetseng pele tse kang alumina, silicon carbide, le aluminium nitride li sebelisoa haholo sebakeng sa sefofane, sephutheloana sa semiconductor, le lisebelisoa tsa biomedical. Leha ho le joalo, ka lebaka la brittleness ea tlhaho le ho fokotseha ho fokolang ha lisebelisoa tsena, ho sebetsa ka mokhoa o nepahetseng ho 'nile ha nkoa e le phephetso e boima. Lilemong tsa morao tjena, ka ts'ebeliso ea lisebelisoa tse ncha tsa ho itšeha, lits'ebetso tse kopaneng, le mahlale a bohlale a ho lekola, butle-butle libotlolo tsa machining tsa ceramic li ntse li hlōloa.
Bothata: Boima bo phahameng le Brittleness Coexist
Ho fapana le litšepe, li-ceramics li kotsing ea ho phatloha le ho pshatleha ha ho etsoa machining. Ka mohlala, silicon carbide e thata haholo, 'me lisebelisoa tsa setso tsa ho itšeha hangata li khathala ka potlako, e leng se bakang bophelo ba karolo ea leshome feela ea ho sebetsa ka tšepe. Liphello tsa mocheso le tsona ke kotsi e kholo. Ho eketseha ha mocheso sebakeng sa heno nakong ea mechine ho ka lebisa phetohong ea mekhahlelo le khatello ea maikutlo e setseng, e leng se bakang tšenyo e ka tlas'a lefatše e ka senyang ho tšepahala ha sehlahisoa sa ho qetela. Bakeng sa li-semiconductor substrates, esita le tšenyo ea nanometer-scale e ka senya mocheso oa mocheso oa chip le ts'ebetso ea motlakase.
Tsoelo-pele ea Theknoloji: Lisebelisoa tsa Superhard Cutting le Mekhoa e Kopanetsoeng
Ho hlola mathata ana a machining, indasteri e ntse e tsoela pele ho hlahisa lisebelisoa tse ncha tsa ho itšeha le litharollo tsa ntlafatso ea ts'ebetso. Polycrystalline diamond (PCD) le li-cubic boron nitride (CBN) lisebelisoa tsa ho itšeha butle-butle li nkile sebaka sa lisebelisoa tsa ho itšeha tsa carbide, ho ntlafatsa haholo ho hanyetsa ho roala le botsitso ba machining. Ho feta moo, ts'ebeliso ea li-ultrasonic vibration-assisted cutting and ductile-domain machining technologies e nolofalelitse "polasetiki-joaloka" ho khaola lisebelisoa tsa ceramic, tseo pele li neng li tlosoa feela ka ho robeha ha brittle, kahoo ho fokotsa ho senya le ho senya.
Mabapi le phekolo ea holim'a metsi, mahlale a macha a kang ho belisoa ha lik'hemik'hale (CMP), magnetorheological polishing (MRF), le polisha-assisted polishing (PAP) li khanna likarolo tsa ceramic nakong ea ho nepahala ha boemo ba nanometer. Mohlala, li-substrates tsa aluminium nitride heat sink, ka CMP e kopantsoeng le lits'ebetso tsa PAP, li fihletse maemo a holimo a tlase ho 2nm, e leng sa bohlokoa haholo indastering ea semiconductor.
Melemo ea Kopo: Ho tloha ho Chips ho ea ho Bophelo bo Botle
Lintlafatso tsena tsa theknoloji li ntse li fetoleloa ka potlako lits'ebetsong tsa indasteri. Baetsi ba li-semiconductor ba sebelisa lisebelisoa tsa mochini o thata haholo le lits'ebetso tsa puseletso ea liphoso tsa mocheso ho netefatsa botsitso ba liphaephe tse kholo tsa ceramic. Sebakeng sa biomedical, libaka tse rarahaneng tse kobehileng tsa li-implants tsa zirconia li entsoe ka nepo e phahameng ka ho belisoa ha magnetorheological. Ha e kopantsoe le lits'ebetso tsa laser le ho roala, sena se ntlafatsa le ho feta biocompatibility le ho tšoarella.
Mekhoa ea Bokamoso: Tlhahiso e Bohlale le e Tala
Ha u sheba pele, mochini o nepahetseng oa ceramic o tla ba bohlale le ho feta le ho boloka tikoloho. Ka lehlakoreng le leng, bohlale ba maiketsetso le mafahla a dijithale li ntse li kenyeletsoa lits'ebetsong tsa tlhahiso, tse nolofalletsang ntlafatso ea nako ea 'nete ea litsela tsa lisebelisoa, mekhoa ea ho pholisa, le mekhoa ea mochini. Ka lehlakoreng le leng, moralo oa gradient ceramic le recycle ea litšila li fetoha libaka tsa lipatlisiso, li fana ka mekhoa e mecha ea tlhahiso e tala.
Qetello
Hoa hlokomeleha esale pele hore mochini o nepahetseng oa ceramic o tla tsoela pele ho fetohela "ho nepahala ha nano, tšenyo e tlase, le taolo e bohlale." Bakeng sa indasteri ea lefats'e ea tlhahiso, sena ha se emetse feela katleho ea ho lokisa thepa empa hape ke sesupo sa bohlokoa sa tlholisano ea nako e tlang liindastering tsa maemo a holimo. E le karolo ea bohlokoa ea tlhahiso e tsoetseng pele, tsoelo-pele ea machining ea ceramic e tla susumetsa ka ho toba liindasteri tse kang aerospace, semiconductors le biomedicine ho ea holimo.
Nako ea poso: Sep-23-2025