Lilemong tsa morao tjena, ts'ebeliso ea lijo-granite e le thepa e fumanehang kopanong ea semisonductor ts'ebetso e neng e tumme. Sena ke hobane granite e na le menyetla e mengata holim'a lisebelisoa tse ling, haholo tšepe. Below are some reasons why choosing granite over metal is beneficial:
1. Ho tsitsa
One of the main advantages of granite is its stability. Granite has a low coefficient of thermal expansion, which means it can resist changes in temperature and humidity. Bokhoni bona bo bohlokoa bakeng sa tlhahiso ea semiconductor hobane lisebelisoa tsena li hloka taolo ea mocheso le maemo a tlase a vibration ho sebetsa ka nepo.
2. Ho tšoarella
Granite is a very durable material. It is resistant to impact, abrasion, and scratches. This is important because semiconductor manufacturing often involves the use of abrasive chemicals and tools that can damage other materials. Ho tšoarella ha glurate ho netefatsa hore phutheho ea Sehamiconductor Lisebelisoa tsa Tlhahiso ea Sehamiconductor li ka tšoarella le ho taboha.
Granite has a very smooth and uniform surface, which makes it ideal for use in precision manufacturing. Tsela e ka fihlellang ka granite e bohlokoa ha e etsoa sesebelisoa sa secouctor se hlokang maemo a phahameng a ho nepahala le ho hloka taolo.
Although granite may initially seem more expensive than metal, it is actually a cost-effective choice over the long term. Due to its durability and stability, it requires less maintenance and replacement, making it a better value for money. Ho feta moo, hobane Granite ke thepa ea tlhaho, e fumaneha ka bophara ebile e bonolo ho e fumana e theko e boima ho feta lisebelisoa tse ling.
In conclusion, choosing granite over metal can provide many benefits when assembling semiconductor manufacturing process devices. Ho tloha botsitso ba eona le ho se bolokehe ho thepa ea bona ea bo-racoustic, granite ke thepa e loketseng hore e sebelisoe lefatšeng lena le batloang la semiconductor Its cost-effectiveness also makes it an attractive choice. Overall, granite is a positive choice for the assembly of semiconductor manufacturing process devices.
Nako ea ho romella: Dec-06-2023