Sebakeng sa litsamaiso tsa mahlo tse nepahetseng haholo—ho tloha lisebelisoa tsa lithography ho ea ho li-interferometer tsa laser—ho nepahala ha ho lumellana ho khetholla ts'ebetso ea sistimi. Khetho ea thepa ea substrate bakeng sa liforomo tsa ho hokahanya mahlo ha se feela khetho ea ho fumaneha empa ke qeto ea bohlokoa ea boenjiniere e amang ho nepahala ha tekanyo, botsitso ba mocheso le ts'epo ea nako e telele. Tlhahlobo ena e hlahloba litlhaloso tse hlano tsa bohlokoa tse etsang hore substrates tsa khalase tse nepahetseng e be khetho e khethiloeng bakeng sa litsamaiso tsa ho hokahanya mahlo, tse tšehelitsoeng ke data ea bongata le mekhoa e metle ea indasteri.
Selelekela: Karolo ea Bohlokoa ea Lisebelisoa tsa Substrate ho Alignment ea Optical
Tlhaloso ea 1: Phetiso ea Optical le Ts'ebetso ea Spectral
| Thepa | Phetiso e Bonahalang (400-700 nm) | Phetiso e Haufi le IR (700-2500 nm) | Bokgoni ba ho ba Bokaholimo |
|---|---|---|---|
| N-BK7 | >95% | >95% | Ra ≤ 0.5 nm |
| Silika e kopantsoeng | >95% | >95% | Ra ≤ 0.3 nm |
| Borofloat®33 | ~92% | ~90% | Ra ≤ 1.0 nm |
| AF 32® tikoloho | ~93% | >93% | Ra < 1.0 nm RMS |
| Zerodur® | Ha e bonahale (e bonahala e sa bonahale) | Ha e eo | Ra ≤ 0.5 nm |
Boleng ba Bokaholimo le ho Hasana:
Tlhaloso ea 2: Bokaholimo bo bataletseng le botsitso ba litekanyo
| Tlhaloso ea Flatness | Sehlopha sa Kopo | Linyeoe tse Tloaelehileng tsa Tšebeliso |
|---|---|---|
| ≥1λ | Sehlopha sa khoebo | Leseli le akaretsang, ho lumellana ho sa hlokeng bohlokoa |
| λ/4 | Sehlopha sa ho sebetsa | Li-laser tse nang le matla a mahareng a tlase, litsamaiso tsa ho nka litšoantšo |
| ≤λ/10 | Kereiti ea ho nepahala | Li-laser tse matla haholo, litsamaiso tsa metrology |
| ≤λ/20 | Ho nepahala ho hoholo | Kopano ea Interferometry, lithography, photonics |
Liphephetso tsa Tlhahiso:
Tlhaloso ea 3: Katoloso ea Thermal Coefficient (CTE) le Botsitso ba Thermal
| CTE (×10⁻⁶/K) | Phetoho ea litekanyo ka °C | Phetoho ea litekanyo ka 5°C Phetoho |
|---|---|---|
| 23 (Aluminium) | 4.6 μm | 23 μm |
| 7.2 (Tšepe) | 1.44 μm | 7.2 μm |
| 3.2 (AF 32® eco) | 0.64 μm | 3.2 μm |
| 0.05 (ULE®) | 0.01 μm | 0.05 μm |
| 0.007 (Zerodur®) | 0.0014 μm | 0.007 μm |
Lihlopha tsa Boitsebiso ka CTE:
- CTE: 0 ± 0.05 × 10⁻⁶/K (ULE) kapa 0 ± 0.007 × 10⁻⁶/K (Zerodur)
- Ditshebediso: Interferometry e nepahetseng haholo, dibonela-hōle tsa sebaka, diipone tsa lithography
- Phetisetso: Litšenyehelo tse phahameng, phetiso e fokolang ea optical ho spectrum e bonahalang
- Mohlala: Seipone sa Hubble Space Telescope se sebelisa khalase ea ULE e nang le CTE < 0.01 × 10⁻⁶/K
- CTE: 3.2 × 10⁻⁶/K (e tsamaellana hantle le silicon ea 3.4 × 10⁻⁶/K)
- Ditshebediso: Sephutheloana sa MEMS, kopanyo ya difotoniki tsa silicon, teko ya semiconductor
- Molemo: E fokotsa khatello ea mocheso liphuthelong tse kopantsoeng
- Tshebetso: E nolofalletsa ho se tshwane ha CTE ka tlase ho 5% le di-substrate tsa silicon
- CTE: 7.1-8.2 × 10⁻⁶/K
- Dikopo: Ho hokahanya mahlo ka kakaretso, ditlhoko tse itekanetseng tsa ho nepahala
- Molemo: Phetiso e ntle ea optical, litšenyehelo tse tlase
- Moedi: E hloka taolo e sebetsang ea mocheso bakeng sa lits'ebetso tse nepahetseng haholo
Tlhaloso ea 4: Thepa ea Mekaniki le ho Sireletsa ho Thothometsa
| Thepa | Modulus ea Young (GPa) | Ho satalla ho Itseng (E/ρ, 10⁶ m) |
|---|---|---|
| Silika e kopantsoeng | 72 | 32.6 |
| N-BK7 | 82 | 34.0 |
| AF 32® tikoloho | 74.8 | 30.8 |
| Aluminium 6061 | 69 | 25.5 |
| Tšepe (440C) | 200 | 25.1 |
Tlhokomelo: Le hoja tšepe e na le ho tiea ho hoholo ka ho feletseng, ho tiea ha eona ho itseng (karolelano ea ho tiea-ho-boima) ho tšoana le aluminium. Lisebelisoa tsa khalase li fana ka ho tiea ho itseng ho tšoanang le litšepe ka melemo e meng: thepa e seng ea makenete le ho hloka tahlehelo ea hona joale ea eddy.
- Ho Ikarola ka Maqhubu a Tlase: Ho fanoa ke li-isolator tsa pneumatic tse nang le maqhubu a resonant a 1-3 Hz
- Ho Fokotsa Metsi a Mahareng: Ho hatelloa ke khohlano ea ka hare ea substrate le moralo oa sebopeho
- Ho sefa ka maqhubu a phahameng: Ho fihlelleha ka ho se tsamaisane ha boima ba 'mele le impedance
- Mocheso o tloaelehileng oa ho kenya metsi: 0.8 × Tg (mocheso oa phetoho ea khalase)
- Nako ea ho annealing: Lihora tse 4-8 bakeng sa botenya ba 25 mm (likala tse nang le botenya bo sekoere)
- Sekhahla sa ho pholisa: 1-5°C/hora ho pholletsa le ntlha ea khatello
Tlhaloso ea 5: Ho Tsitsisa Lik'hemik'hale le Khanyetso ea Tikoloho
| Mofuta oa Khanyetso | Mokhoa oa Teko | Tlhophiso | Moeli |
|---|---|---|---|
| Hydrolytic | ISO 719 | Sehlopha sa 1 | <10 μg Na₂O e lekanang ka gram |
| Asiti | ISO 1776 | Sehlopha sa A1-A4 | Ho theola boima ba 'mele ka mor'a ho pepesehela asiti |
| Alkali | ISO 695 | Sehlopha sa 1-2 | Ho theola boima ba 'mele ka mor'a ho pepesehela alkali |
| Boemo ba leholimo | Ho pepesehela kantle | E babatsehang | Ha ho na tshenyeho e ka lekanngoang kamora dilemo tse 10 |
Ho lumellana ha ho Hloekisa:
- Joala ba Isopropyl (IPA)
- Acetone
- Metsi a hloekisitsoeng
- Litharollo tse khethehileng tsa ho hloekisa mahlo
- Silica e kopantsoeng: < 10⁻¹⁰ Torr·L/s·cm²
- Borosilicate: < 10⁻⁹ Torr·L/s·cm²
- Aluminium: 10⁻⁸ – 10⁻⁷ Torr·L/s·cm²
- Silica e kopantsoeng: Ha ho na tahlehelo ea phetisetso e ka lekanngoang ho fihlela ho tekanyo eohle ea krad ea 10
- N-BK7: Tahlehelo ea phetisetso <1% ho 400 nm kamora krad e le 'ngoe
- Silica e kopantsoeng: Botsitso ba litekanyo < 1 nm ka selemo tlas'a maemo a tloaelehileng a laboratori
- Zerodur®: Botsitso ba litekanyo < 0.1 nm ka selemo (ka lebaka la botsitso ba karolo ea kristale)
- Aluminium: Ho kheloha ha tekanyo 10-100 nm ka selemo ka lebaka la phomolo ea khatello ea maikutlo le potoloho ea mocheso
Moralo oa Khetho ea Lintho: Ho Bapisa Litlhaloso le Litšebeliso
Tekanyo e Phahameng ka ho Fetisisa ea ho Lokisa ka ho Sebetsa (≤ho nepahala ha ≤10 nm)
- Bophara: ≤ λ/20
- CTE: Haufi le lefela (≤0.05 × 10⁻⁶/K)
- Phetisetso: >95%
- Ho thiba ho thothomela: Khohlano ea ka hare ea High-Q
- ULE® (Khoutu ea Corning 7972): Bakeng sa lits'ebetso tse hlokang phetiso e bonahalang/NIR
- Zerodur®: Bakeng sa lits'ebetso moo phetiso e bonahalang e sa hlokeheng
- Silica e kopantsoeng (ea boemo bo holimo): Bakeng sa lits'ebetso tse nang le litlhoko tse itekanetseng tsa botsitso ba mocheso
- Mehato ea ho hokahanya lithography
- Metrology ea Interferometric
- Litsamaiso tsa mahlo tse thehiloeng sebakeng
- Kopano ea li-photonics tse nepahetseng
Tekanyo e Phahameng ea ho Lokisa (ho nepahala ha 10-100 nm)
- Bophara: λ/10 ho isa ho λ/20
- CTE: 0.5-5 × 10⁻⁶/K
- Phetisetso: >92%
- Khanyetso e ntle ea lik'hemik'hale
- Silica e kopantsoeng: Tshebetso e ntle ka kakaretso
- Borofloat®33: Ho hanyetsa mocheso hantle, CTE e itekanetseng
- AF 32® eco: CTE e bapisang Silicon bakeng sa kopanyo ea MEMS
- Ho lokisa machining ka laser
- Kopano ea faeba optic
- Tlhahlobo ea semiconductor
- Batlisisa litsamaiso tsa mahlo
Tekanyo e Akaretsang ea ho Lokisa ka ho Sebetsa (ho nepahala ha 100-1000 nm)
- Bophara: λ/4 ho isa ho λ/10
- CTE: 3-10 × 10⁻⁶/K
- Phetisetso: >90%
- E bolokang tjhelete
- N-BK7: Khalase e tloaelehileng ea optical, phetiso e ntle haholo
- Borofloat®33: Tshebetso e ntle ya mocheso, theko e tlase ho feta silika e kopantsweng
- Khalase ea soda-lime: E theko e tlaase bakeng sa lits'ebetso tse seng tsa bohlokoa
- Mabone a thuto
- Mekhoa ea ho hokahanya indasteri
- Lihlahisoa tsa mahlo tsa bareki
- Lisebelisoa tsa laboratori tse akaretsang
Lintho Tse ka Amehang ka Tlhahiso: Ho Finyella Litlhaloso tse Hlano tsa Bohlokoa
Mekhoa ea ho Qetella Bokaholimo
- Ho Sila ka Bohloko: Ho tlosa thepa e ngata, ho fihlella mamello ea botenya ± 0.05 mm
- Ho Sila Hantle: Ho fokotsa ho teteana ha bokaholimo ho Ra ≈ 0.1-0.5 μm
- Ho bentša: Ho fihlela qetello ea ho qetela ea bokaholimo Ra ≤ 0.5 nm
- Ho ba sephara ho tsitsitseng ho pholletsa le substrates tsa 300-500 mm
- Nako ea ts'ebetso e fokotsehile ka 40-60%
- Bokhoni ba ho lokisa liphoso tsa maqhubu a bohareng ba sebaka
- Mocheso oa ho tšela metsi: 0.8 × Tg (mocheso oa phetoho ea khalase)
- Nako ea ho inela: lihora tse 4-8 (likala tse nang le botenya bo lekanang le lisekoere)
- Sekhahla sa ho pholisa: 1-5°C/hora ho pholletsa le ntlha ea khatello
Netefatso ea Boleng le Metrology
- Interferometry: Zygo, Veeco, kapa li-interferometer tse tšoanang tsa laser tse nang le ho nepahala ha λ/100
- Bolelele ba bolelele ba leqhubu: Hangata ke 632.8 nm (leselara ea HeNe)
- Lesoba: Lesoba le hlakileng le lokela ho feta 85% ea bophara ba substrate
- Microscopy ea Matla a Atomiki (AFM): Bakeng sa netefatso ea Ra ≤ 0.5 nm
- Interferometry ea Leseli le Lesoeu: Bakeng sa ho rarahana ha 0.5-5 nm
- Profilometry ea ho ikopanya: Bakeng sa ho rarahana > 5 nm
- Dilatometry: Bakeng sa tekanyo e tloaelehileng ea CTE, ho nepahala ±0.01 × 10⁻⁶/K
- Tekanyo ea CTE e fapaneng: Bakeng sa thepa ea CTE e tlase haholo, ho nepahala ±0.001 × 10⁻⁶/K
- Fizeau interferometry: Bakeng sa ho lekanya homogeneity ea CTE ho pholletsa le li-substrate tse kholo
Mehopolo ea Kopanyo: Ho kenyelletsa Li-substrate tsa Khalase ho Litsamaiso tsa ho Lekanya
Ho Hloma le ho Hloma
- Lithapo tsa mahe a linotši: Bakeng sa lithapo tse kholo, tse bobebe tse hlokang ho tiea haholo
- Ho tlama ka mathōko: Bakeng sa li-substrate moo mahlakore ka bobeli a lokelang ho lula a le teng
- Lithapo tse kopantsoeng: Ho sebelisoa likhomaretsi tsa optical kapa li-epoxies tse sa ntšeng khase haholo
Tsamaiso ea Thermal
- Ho nepahala ha taolo: ± 0.01°C bakeng sa litlhoko tsa ho batalla ha λ/20
- Ho tšoana: < 0.01°C/mm holim'a bokaholimo ba substrate
- Ho tsitsa: Ho thekesela ha mocheso < 0.001°C/hora nakong ea ts'ebetso ea bohlokoa
- Lithebe tsa mocheso: Lithebe tsa mahlaseli a mangata tse nang le masela a tlaase a ntšang mosi
- Ho kenya mocheso: Lisebelisoa tsa ho kenya mocheso tse sebetsang hantle haholo
- Boima ba mocheso: Ho feto-fetoha ha mocheso ho latela li-buffers tse kholo tsa mocheso
Taolo ea Tikoloho
- Ho hlahisa likaroloana: < likaroloana tse 100/ft³/min (Sehlopha sa 100 sa kamore ea ho hloekisa)
- Ho ntša khase e ngata: < 1 × 10⁻⁹ Torr·L/s·cm² (bakeng sa lits'ebetso tsa vacuum)
- Ho Hloeka: E tlameha ho mamella ho hloekisoa khafetsa ha IPA ntle le ho senyeha
Tlhahlobo ea Melemo ea Litšenyehelo: Li-substrate tsa Khalase khahlanong le Mekhoa e meng
Papiso ea Litšenyehelo tsa Pele
| Lisebelisoa tsa Substrate | Bophara ba 200 mm, Botenya ba 25 mm (USD) | Litšenyehelo tse Lekaneng |
|---|---|---|
| Khalase ea soda le kalaka | $50-100 | 1 × |
| Borofloat®33 | $200-400 | 3-5× |
| N-BK7 | $300-600 | 5-8× |
| Silika e kopantsoeng | $800-1,500 | 10-20× |
| AF 32® tikoloho | $500-900 | 8-12× |
| Zerodur® | $2,000-4,000 | 30-60× |
| ULE® | $3,000-6,000 | 50-100× |
Tlhahlobo ea Litšenyehelo tsa Potoloho ea Bophelo
- Lisebelisoa tsa khalase: Bophelo ba lilemo tse 5-10, tlhokomelo e fokolang
- Lisebelisoa tsa tšepe: Bophelo ba lilemo tse 2-5, ho hlokahala ho lokisa bokaholimo nako le nako
- Li-substrate tsa polasetiki: bophelo bohle ba likhoeli tse 6-12, ho nkeloa sebaka khafetsa
- Lisebelisoa tsa khalase: Nolofatsa ho nepahala ha ho hokahanya ka 2-10× ho feta mekhoa e meng
- Lisebelisoa tsa tšepe: Li lekanyelitsoe ke botsitso ba mocheso le ho senyeha ha bokaholimo
- Li-substrate tsa polasetiki: Li lekanyetsoa ke ho thekesela le ho se utloisise tikoloho
- Phetiso e phahameng ea optical: lipotoloho tsa ho hokahanya tse potlakileng ka 3-5%
- Ho tsitsa ha mocheso ho betere: Tlhoko e fokotsehileng ea ho leka-lekanya mocheso
- Tlhokomelo e tlase: Nako e fokolang ea ho phomola bakeng sa ho hlophisa bocha
Mekhoa ea Nakong e Tlang: Theknoloji ea Khalase e Hlahang bakeng sa Tekano ea Mahlo
Lisebelisoa tsa Khalase tse Entsoeng ka Boenjiniere
- ULE® E Lokisitsoeng: Mocheso oa ho tšela lefela oa CTE o ka hlalosoa ho ±5°C
- Likhalase tsa CTE tse nang le Gradient: Gradient ea CTE e entsoeng ka boenjiniere ho tloha holim'a bokaholimo ho ea bohareng
- Phapang ea CTE ea Libaka: Litekanyetso tse fapaneng tsa CTE libakeng tse fapaneng tsa substrate e tšoanang
- Ho kopanngoa ha tataiso ea maqhubu: Ho ngoloa ka ho toba ha tataiso ea maqhubu ka har'a substrate ea khalase
- Likhalase tse nang le doped: Likhalase tse nang le doped ea Erbium kapa tse nang le doped ea mobu o sa tloaelehang bakeng sa mesebetsi e sebetsang
- Likhalase tse sa meleng: Palo e phahameng ea palo e sa meleng bakeng sa phetoho ea maqhubu
Mekhoa e Tsoetseng Pele ea Tlhahiso
- Li-geometri tse rarahaneng li ke ke tsa khoneha ka mokhoa oa setso
- Mekanale e kopantsoeng ea ho pholisa bakeng sa taolo ea mocheso
- Litšenyehelo tse fokotsehileng tsa thepa bakeng sa libopeho tse ikhethileng
- Ho bopa khalase ka nepo: Ho nepahala ha sub-micron holim'a libaka tse bonesang
- Ho theoha ka mandrel: Finyella ho kobeha ho laolehileng ka ho qeta bokaholimo ba Ra < 0.5 nm
Li-substrate tsa Khalase tse Bohlale
- Li-sensor tsa mocheso: Tlhokomelo ea mocheso e ajoang
- Litekanyo tsa khatello: Tekanyo ea khatello/phetoho ea nako ea sebele
- Li-sensor tsa boemo: Metrology e kopaneng bakeng sa ho itlhophisa
- Ho sebetsa ha mocheso: Li-heater tse kopantsoeng bakeng sa taolo e sebetsang ea mocheso
- Ts'ebetso ea Piezoelectric: Phetoho ea boemo ba tekanyo ea Nanometer
- Optics e ikamahanyang le maemo: Tokiso ea setšoantšo sa bokaholimo ka nako ea sebele
Qetello: Melemo ea Leano la Li-substrate tsa Khalase tse Hloahloa
Moralo oa Liqeto
- Ho nepahala ha ho Lokisa ho Hlokahalang: Ho khetholla litlhoko tsa ho batalla le tsa CTE
- Mefuta ea Wavelength: Litataiso tsa phetiso ea optical
- Maemo a Tikoloho: A susumetsa litlhoko tsa CTE le botsitso ba lik'hemik'hale
- Bophahamo ba Tlhahiso: E ama tlhahlobo ea litšenyehelo le melemo
- Litlhoko tsa Molao: E ka laela lisebelisoa tse itseng bakeng sa setifikeiti
Molemo oa ZHHIMG
- Phihlello ea thepa ea khalase ea boleng bo holimo ho tsoa ho bahlahisi ba ka sehloohong
- Litlhaloso tsa thepa e ikhethileng bakeng sa lits'ebetso tse ikhethang
- Tsamaiso ea ketane ea phepelo bakeng sa boleng bo tsitsitseng
- Lisebelisoa tsa ho sila le ho bentša tsa sejoale-joale
- Ho bentša ho laoloang ke khomphutha bakeng sa ho batalla ha λ/20
- Metrology ea ka hare bakeng sa netefatso ea litlhaloso
- Moralo oa substrate bakeng sa lits'ebetso tse ikhethileng
- Litharollo tsa ho hloma le ho lokisa
- Kopanyo ea taolo ea mocheso
- Tlhahlobo e felletseng le setifikeiti
- Litokomane tsa ho sala morao
- Ho latela maemo a indasteri (ISO, ASTM, MIL-SPEC)
Nako ea poso: Hlakubele-17-2026
